Heat sink mountable design with non-inductive performance, featuring an
exposed copper heat dissipating mounting surface electrically insulated.
Use your thermal design experience with power semiconductors. This
experience will help you get the most out of this unique family of high
performance (Hi-Per) Shunts.
The thermal design issues are the same where the power handling capability
is based on the case temperature which is maintained in your design.
Resistor element is electrically isolated from the mounting metal heat
The case temperature is to be used for the purpose of establishing the
maximum applied power.